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ENGINEERING TOOLS / THERMAL DESIGN

Heat Sink Size Calculator

Find a starting size for your passive heat sink. Set the thermal requirements, explore the geometry, and compare designs.

iVertical fins · Natural convection + radiation · Full-base heat source↓

Design inputs

Illustrative inputs, not validated product designs.
01Thermal requirements
W
Actual heat loss, not total electrical input power.
°C
°C
Tₛ is the idealized sink/base temperature, not the semiconductor junction temperature.
02Geometry constraints
Dimensions you can control
mm
mm
mm
mm
L follows the upward airflow. H is the fin projection from the base. Width is calculated.
03Surface radiation
0–1
Presets are illustrative. Use measured or supplier data for the actual finish.
Results update as you edit
YOUR STARTING DESIGN

A size to build on.

Preliminary estimate
Required width · W
-mm
Fin spacing · s
-mm
Number of fins · N
-fins
Geometry previewVERTICAL / OPEN AIR

Schematic only. Fin count may be visually simplified; use the calculated dimensions.

Modeled heat dissipation- W
Sink-to-air resistance budget- °C/W
Convection Radiation
Dissipation at the selected base temperature; integer fins can exceed the target. No safety factor is included.
i

Assumes an isothermal, highly conductive heat sink with heat spread across the full base. Small chips, interface resistance, enclosures and fan cooling need a more detailed analysis.

Compare your options

Save up to three concepts to see the trade-offs side by side.

Your saved designs will appear here.

Change a dimension, save a concept, then compare.
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Understand the estimate.

A transparent first pass for passive, straight-fin heat sinks. Useful for sizing a concept before detailed thermal analysis.

Read the fin-spacing reference ↗
How are width and spacing calculated?

The Bar-Cohen–Rohsenow correlation estimates the convection-optimal gap for vertical, isothermal parallel fins. Air properties are approximated at the mean air/base temperature and 1 atm. The smallest integer fin count that meets the heat load is selected.

s = 2.714 L / RaL¼W = Nt + (N − 1)s

Radiation uses a projected-envelope approximation to limit double counting between facing fins. The gap optimizes convection under thin-fin assumptions; it is not a global optimum for combined radiation, volume or cost.

When is this model suitable?
  • Vertical base and open, unobstructed upward air channels. Still air at approximately sea-level pressure.
  • Uniform base/fin temperature, highly conductive material, and a heat source covering the full rear base.
  • Steady state. Surrounding radiative temperature equals ambient air temperature.

Fin efficiency, spreading/contact resistance, junction temperature, nearby walls, altitude and manufacturing limits are not solved. Base thickness affects geometry and exposed edge area, not a conduction calculation. Validate the actual design with analysis and testing.

What should I send for a manufacturing review?

Export your concept and include the CAD model, material, surface finish, mounting orientation, heat source footprint, airflow constraints and quantity with your inquiry. The result is a sizing concept, not a manufacturability or thermal-performance guarantee.

Take the concept into manufacturing.

Share your drawing, quantity and thermal constraints for a manufacturing review.

Your files stay confidential. An NDA is optional.
Get a Quote ↗Attach the exported report to your inquiry.
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